(module SW_EG1271A (layer F.Cu) (tedit 6668ED6F)
  (descr "")
  (fp_text reference REF** (at -1.86 -3.508 0) (layer F.SilkS))
  (fp_text value SW_EG1271A (at 0.68 3.308 0) (layer F.Fab))
  (pad 1 thru_hole rect (at -2.5 -1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 2 thru_hole circle (at 0.0 -1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 3 thru_hole circle (at 2.5 -1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 4 thru_hole circle (at -2.5 1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 5 thru_hole circle (at 0.0 1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
  (pad 6 thru_hole circle (at 2.5 1.6) (size 1.308 1.308) (drill 0.8) (layers *.Cu *.Mask) (solder_mask_margin 0.102))
)